Amkor Technology Inc

AMKR Real Time Price USD
N/A
N/A
N/A
...
Overview
Financials
Insiders
Institutions
Government

Chart provided by TradingView

Income
Balance Sheet
Cash Flow
AMKR Income Statement
AMKR Balance Sheet
AMKR Cash Flow
Congress Trading

Recent trades of AMKR by members of U.S. Congress

Quiver Logo

No Congress Trading data for this ticker

Congress Trading Dashboard
AMKR Stock Insider Trading Activity
Name
Type
Shares
Price
Shares Held
Date
Reported
AMKR Stock Institutional Owners
Investor
Shares
Change in Shares
Market Value
Date
Reported
AMKR Derivatives Institutional Owners
Investor
Type
Shares
Change in Shares
Market Value
Date
Reported
Whale Activity

Recently reported changes by institutional investors

Insider Trading

Quarterly net insider trading by AMKR's directors and management

Corporate Lobbying

Government lobbying spending instances

  • $60,000 Feb 08, 2007 Issue: Copyright/Patent/Trademark
  • $60,000 Aug 10, 2006 Issue: Copyright/Patent/Trademark
  • $60,000 Feb 23, 2006 Issue: Copyright/Patent/Trademark
  • $60,000 Aug 11, 2005 Issue: Copyright/Patent/Trademark
  • $40,000 Feb 14, 2005 Issue: Copyright/Patent/Trademark
Corporate Lobbying

Estimated quarterly lobbying spending

Quiver Logo

No Corporate Lobbying data for this ticker

Corporate Lobbying Dashboard
U.S. Patents

New patents grants

  • Patent Title: Embedded vibration management system having an array of vibration absorbing structures Dec. 08, 2020
  • Patent Title: Electronic device with top side pin array and manufacturing method thereof Nov. 10, 2020
  • Patent Title: Semiconductor package using a polymer substrate Nov. 03, 2020
  • Patent Title: Thin bonded interposer package Oct. 27, 2020
  • Patent Title: Embedded ball land substrate, semiconductor package, and manufacturing methods Oct. 27, 2020
  • Patent Title: Encapsulated semiconductor package Oct. 20, 2020
  • Patent Title: Electronic device with adaptive vertical interconnect and fabricating method thereof Sep. 29, 2020
  • Patent Title: Semiconductor device with optically-transmissive layer and manufacturing method thereof Sep. 22, 2020
  • Patent Title: Semiconductor package and fabricating method thereof Sep. 22, 2020
  • Patent Title: Wafer-level stack chip package and method of manufacturing the same Sep. 22, 2020
  • Patent Title: System and method for laser assisted bonding of an electronic device Sep. 01, 2020
  • Patent Title: Semiconductor device with tiered pillar and manufacturing method thereof Aug. 18, 2020
  • Patent Title: Method and system for packing optimization of semiconductor devices Aug. 04, 2020
  • Patent Title: Semiconductor devices and methods of making semiconductor devices Jul. 14, 2020
  • Patent Title: Semiconductor device package and manufacturing method thereof Jul. 14, 2020
  • Patent Title: Semiconductor device with redistribution layers formed utilizing dummy substrates Jul. 07, 2020
  • Patent Title: Electronic device package and fabricating method thereof Jun. 23, 2020
  • Patent Title: Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof Jun. 09, 2020
  • Patent Title: Semiconductor package with high routing density patch Jun. 02, 2020
  • Patent Title: Semiconductor package using cavity substrate and manufacturing methods Jun. 02, 2020
  • Patent Title: Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Jun. 02, 2020
  • Patent Title: Sensor package and manufacturing method thereof Jun. 02, 2020
  • Patent Title: Wafer level package and fabrication method May. 26, 2020
  • Patent Title: Semiconductor package and fabricating method thereof Mar. 10, 2020
  • Patent Title: Packaging for fingerprint sensors and methods of manufacture Mar. 03, 2020
  • Patent Title: Packaged electronic device having integrated antenna and locking structure Feb. 18, 2020
  • Patent Title: Semiconductor package with emi shield and fabricating method thereof Feb. 04, 2020
  • Patent Title: Semiconductor device and manufacturing method thereof Feb. 04, 2020
  • Patent Title: Stackable via package and method Jan. 28, 2020
  • Patent Title: Method of forming a plurality of electronic component packages Jan. 28, 2020
  • Patent Title: Semiconductor package and manufacturing method thereof Jan. 14, 2020
  • Patent Title: Stiffener package and method of fabricating stiffener package Jan. 14, 2020
  • Patent Title: Method of forming a packaged semiconductor device having enhanced wettable flank and structure Jan. 07, 2020
  • Patent Title: Semiconductor device and manufacturing method thereof Dec. 24, 2019
  • Patent Title: Semiconductor device and manufacturing method thereof Dec. 10, 2019
  • Patent Title: Semiconductor package structure for improving die warpage and manufacturing method thereof Dec. 10, 2019
  • Patent Title: Semiconductor device and manufacturing method thereof Dec. 10, 2019
  • Patent Title: Semiconductor package and fabricating method thereof Dec. 03, 2019
  • Patent Title: Semiconductor device and manufacturing method thereof Dec. 03, 2019
  • Patent Title: Semiconductor device with optically-transmissive layer and manufacturing method thereof Nov. 26, 2019
  • Patent Title: Semiconductor package having inspection structure and related methods Nov. 26, 2019
  • Patent Title: Semiconductor device and manufacturing method thereof Nov. 19, 2019
  • Patent Title: Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof Nov. 12, 2019
  • Patent Title: Method for fabricating semiconductor package and semiconductor package using the same Nov. 05, 2019
  • Patent Title: Method of manufacturing an electronic device and electronic device manufactured thereby Nov. 05, 2019
  • Patent Title: Encapsulated semiconductor package Oct. 29, 2019
  • Patent Title: Fingerprint sensor and manufacturing method thereof Oct. 15, 2019
  • Patent Title: Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Oct. 08, 2019
  • Patent Title: Shielded electronic component package Sep. 24, 2019
  • Patent Title: Fine pitch copper pillar package and method Sep. 17, 2019
Government Contracts

Federal grants, loans, and purchases

Quiver Logo

No Government Contracts for this ticker

Government Contracts Dashboard
Government Contracts

Estimated quarterly amount awarded from public contracts

Quiver Logo

No recent Government Contracts for this ticker

Government Contracts Dashboard
WallStreetBets

Number of mentions of AMKR in WallStreetBets Daily Discussion

AMKR News

Recent insights relating to AMKR

CNBC Recommendations

Recent picks made for AMKR stock on CNBC

Top ETF Holders

ETFs with the largest estimated holdings in AMKR

AMKR Stock Smart Score

The Quiver Smart Score combines our data on Congress Trading, Lobbying, Insider Trading, CNBC Mentions and more to provide a comprehensive view of the strength of a stock's underlying data.

The Smart Score grades stocks on a scale of 1 (weakest) to 10 (strongest) based on the strength of the underlying data.
?

Sign Up to view AMKR Smart Score

Score Breakdown
Bull Case vs Bear Case

See concise summaries of analyst reports, presenting both bullish and bearish arguments for a stock.

Example:

Bulls Say:

The Bulls Say summary highlights positive aspects of the stock.

Bears Say:

The Bears Say summary points out potential risks and negative aspects of the stock.

Show More
Back To Top