ChipMOS TECHNOLOGIES INC

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Overview
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IMOS Income Statement
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Congress Trading

Recent trades of IMOS by members of U.S. Congress

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IMOS Stock Insider Trading Activity
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IMOS Stock Institutional Owners
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IMOS Derivatives Institutional Owners
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Whale Activity

Recently reported changes by institutional investors

Insider Trading

Quarterly net insider trading by IMOS's directors and management

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Corporate Lobbying

Government lobbying spending instances

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Corporate Lobbying

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U.S. Patents

New patents grants

  • Patent Title: Chip-on-film package structure Feb. 19, 2019
  • Patent Title: Semiconductor device Sep. 04, 2018
  • Patent Title: Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process Jun. 19, 2018
  • Patent Title: Manufacturing process of wafer level chip package structure having block structure Apr. 24, 2018
  • Patent Title: Semicondcutor light-emitting device and fabricating method thereof Jan. 09, 2018
  • Patent Title: Re-distribution layer structure and manufacturing method thereof Jan. 02, 2018
  • Patent Title: Fingerprint sensor chip package structure and manufacturing method thereof Dec. 19, 2017
  • Patent Title: Insulating protrusion in the trench of a re-distribution layer structure Oct. 17, 2017
  • Patent Title: Solder ball, manufacturing method thereof, and semiconductor device Oct. 03, 2017
  • Patent Title: Semiconductor package Aug. 15, 2017
  • Patent Title: Manufacturing method of chip package structure Aug. 15, 2017
  • Patent Title: Multi-chip package structure, wafer level chip package structure and manufacturing process thereof Aug. 08, 2017
  • Patent Title: Semiconductor package and method of manufacturing thereof Aug. 01, 2017
  • Patent Title: Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof May. 16, 2017
  • Patent Title: Chip package structure and method of manufacturing the same Apr. 11, 2017
  • Patent Title: Semiconductor structure and method of manufacturing the same Feb. 21, 2017
  • Patent Title: Chip package structure Sep. 06, 2016
  • Patent Title: Chip package structure and manufacturing method thereof Sep. 06, 2016
  • Patent Title: Quad flat no-lead package and manufacturing method thereof Jul. 26, 2016
  • Patent Title: Flat no-lead package and the manufacturing method thereof Apr. 19, 2016
  • Patent Title: Thermally enhanced electronic package Apr. 05, 2016
  • Patent Title: Chip package structure Feb. 23, 2016
  • Patent Title: Semiconductor package structure and manufacturing method thereof Nov. 24, 2015
  • Patent Title: Manufacturing method for micro bump structure Nov. 17, 2015
  • Patent Title: Conductive structure and method for forming the same Oct. 13, 2015
  • Patent Title: Chip package structure and manufacturing method thereof Sep. 01, 2015
  • Patent Title: Method for wafer level packaging and a package structure thereof Jul. 21, 2015
  • Patent Title: Semiconductor package structure and manufacturing method thereof Jun. 09, 2015
  • Patent Title: Method of manufacturing semiconductor packaging May. 05, 2015
  • Patent Title: Chip structure and multi-chip stack package Apr. 28, 2015
  • Patent Title: Manufacturing method of wafer level package Mar. 17, 2015
  • Patent Title: Qfn package and manufacturing process thereof Feb. 24, 2015
  • Patent Title: Method for manufacturing chip package structure Nov. 25, 2014
  • Patent Title: Semiconductor structure having a silver alloy bump body and manufacturing method thereof Nov. 04, 2014
  • Patent Title: Conductive structure and method for forming the same Oct. 28, 2014
  • Patent Title: Wafer level package structure Sep. 16, 2014
  • Patent Title: Structure of stacking chips and method for manufacturing the same Aug. 19, 2014
  • Patent Title: Conductive structure and method for forming the same Jul. 22, 2014
  • Patent Title: Semiconductor structure having no adjacent bumps between two adjacent pads Jul. 22, 2014
  • Patent Title: Semiconductor structure and manufacturing method thereof Jul. 15, 2014
  • Patent Title: Chip package structure and manufacturing method thereof Jul. 08, 2014
  • Patent Title: Packaging structure May. 27, 2014
  • Patent Title: Chip package structure using flexible substrate May. 13, 2014
  • Patent Title: Computer implemented apparatus for generating and filtering creative proposal Apr. 29, 2014
  • Patent Title: Bump structure and manufacturing method thereof Apr. 15, 2014
  • Patent Title: Semiconductor package structure and manufacturing method thereof Apr. 08, 2014
  • Patent Title: Chip package structure and chip packaging method Feb. 18, 2014
  • Patent Title: Thermally enhanced electronic package Oct. 22, 2013
  • Patent Title: Rfid real-time information system accommodated to semiconductor supply chain Oct. 08, 2013
  • Patent Title: Ventilating apparatus May. 21, 2013
Government Contracts

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Government Contracts

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WallStreetBets

Number of mentions of IMOS in WallStreetBets Daily Discussion

IMOS News

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CNBC Recommendations

Recent picks made for IMOS stock on CNBC

Top ETF Holders

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IMOS Stock Smart Score

The Quiver Smart Score combines our data on Congress Trading, Lobbying, Insider Trading, CNBC Mentions and more to provide a comprehensive view of the strength of a stock's underlying data.

The Smart Score grades stocks on a scale of 1 (weakest) to 10 (strongest) based on the strength of the underlying data.
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